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For full Warranty details please refer to the product profile!
Electronic Packaging Material - Potting and Encapsulating Materials
Details: EPM1-2493 - Thermally conductive, low viscosity silicone elastomer cures with the addition of heat
| Product Profile: | EPM1-2493.pdf |
|---|---|
| MSDS PDF A: | EPM1-2493_EU_English.pdf |
Basic Product Overview: |
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| Section: | Electronic Packaging Material |
| Description: | Potting and Encapsulating Materials |
| NuSil ID: | EPM1-2493 |
| Cure Time/Temp: | 15 M / 150 |
| Specific Gravity: | 2.34 |
| Durometer Type A Typical: | 65 |
| Tensile psi Typical: | 180 |
| Tensile MPa Typical: | 1.2 |
| Elongation Percent Typical: | 50 |
| Lap Shear psi/Mpa: | 120/0.8 |
| Operating Temp: | -50 to 250 |
| Mix Ratio: | 1:1 |
| Colour: | White |
| Comments: | Thermally conductive, low viscosity silicone elastomer cures with the addition of heat |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
